導電性フィルム（Cu蒸着）

▶　様々な基材(PET、PIなど）に導電性付与
　　We can impart conductivity to various substrates (PET, PI, etc.)
▶　銅箔代替、めっきシード層としても使用可能
　　It can also be used as a copper foil substitute and plating seed layer
▶　基材への黒化処理により　導電性＋低反射化　を実現
　　It achieves conductivity and low reflection by blackening the base material.