導電性フィルム（Cu蒸着）

▶　ミリ波など高周波帯域の電磁波を遮蔽
　　　Blocks electromagnetic waves in high frequency bands such as millimeter waves.
▶　延伸後もシールド性を保持
　　　Maintains shielding properties even after stretching.
▶　様々な基材(PET、PIなど）に導電性付与
　　We can impart conductivity to various substrates (PET, PI, etc.)
▶　銅箔代替、めっきシード層としても使用可能
　　It can also be used as a copper foil substitute and plating seed layer